2023

• Meier S., Klarmann S., Thielen N., Pfefferer C., Kuhn M., Franke J.:
  A process model for systematically setting up the data basis for data-driven projects in manufacturing
  In: Journal of Manufacturing Systems 71 (2023), S. 1-19
  ISSN: 0278-6125
  DOI: 10.1016/j.jmsy.2023.08.024
  BibTeX: Download
• Seidel R., Rachinger B., Thielen N., Schmidt K., Meier S., Franke J.:
  Development and validation of a digital twin framework for SMT manufacturing
  In: Computers in Industry 145 (2023)
  ISSN: 0166-3615
  DOI: 10.1016/j.compind.2022.103831
  BibTeX: Download

2022

• Meier S., Albuquerque RQ., Demleitner M., Ruckdaeschel H.:
  Modeling glass transition temperatures of epoxy systems: a machine learning study
  In: Journal of Materials Science 57 (2022), S. 13991-14002
  ISSN: 0022-2461
  DOI: 10.1007/s10853-022-07372-9
  BibTeX: Download
• Meier S., Erkan A., Thielen N., Klarmann S., Franke J.:
  Attention-based Image Compression in Sensor Assembly
  28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
  In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
  DOI: 10.1109/SIITME56728.2022.9987988
  BibTeX: Download
• Schwab M., Madeline-Derou C., Klarmann S., Thielen N., Meier S., Franke J., Chintanippu S., Stork W.:
  Multi-Model Machine Learning based Industrial Vision Framework for Assembly Part Quality Control
  27th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022 (Stuttgart, DEU, 6. September 2022 - 9. September 2022)
  In: IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022
  DOI: 10.1109/ETFA52439.2022.9921587
  BibTeX: Download
• Thielen N., Pan W., Piechulek N., Voigt C., Meier S., Schmidt K., Franke J.:
  Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013210
  BibTeX: Download