| 2022 | |
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Optical Polymer Waveguides – From the Design to the Final 3D-Opto Mechatronic Device |
| 2021 | |
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Simulation in Produktion und Logistik |
| 2020 | |
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The Future of Harness Development and Manufacturing |
| 2019 | |
| 2018 | |
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Tagungsband des 3. Kongresses Montage Handhabung Industrieroboter |
| 2017 | |
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Tagungsband des 2. Kongresses Montage Handhabung Industrieroboter |
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Energy Efficiency in Sustainable Production Vol II |
| 2016 | |
 |
Smarter Services 2016 |
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Tagungsband zum 1. E|Home-Symposium 2016 |
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Tagungsband zum 3. Green Factory Bavaria Kolloquium 2016 |
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2016 12th International Congress Molded Interconnect Devices (MID) |
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Wireless charging technology and the future of electric transportation |
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Entwicklung einer Methodik zur ressourcenorientierten Steuerung der Werksprozesse in der Kalksandstein-Industrie: ‘KS-Sim’ |
| 2015 | |
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Tagungsband zum 2. Green Factory Bavaria Kolloquium 2015 |
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Energy Efficiency in Strategy of Sustainable Production |
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5th International Electric Drives Production Conference |
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An Exergy-Based Analysis of Temperature Profiles for an Over-Pressure Reflow Oven Technology |
|
11th international congress molded interconnect devices |
| 2014 | |
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WGP Congress 2014 |
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11th International Congress Molded Interconnect Devices |
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11th International Congress Molded Interconnect Devices |
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11th International Congress Molded Interconnect Devices |
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Green Factory Bavaria Colloquium 2014 |
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4th International Electric Drives Production Conference |
| 2013 | |
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Räumliche elektronische Baugruppen (3D-MID) |
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Robotergestützte Montage von Wicklungen „RobStatMont“ |
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WGP Congress 2013 – Progress in Production Engineering |
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3D-MID-Anwendungen: Gestaltung – Fertigung – Zuverlässigkeit |
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3rd International Electric Drives Production Conference |
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Fachworkshop Elektromaschinenbau – Aktuelle Entwicklungen in der Wickeltechnik |
| 2012 | |
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10th International Congress Molded Interconnect Devices |
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2nd International Electric Drives Production Conference |
| 2011 | |
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1st International Electric Drives Production Conference |
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Kontaktierungsverfahren und Prozesstechnik für Ultra Fine-Pitch-Baugruppen |
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Herausforderungen und Lösungen für die Montage optischer Komponenten in der SMT-Fertigung |
| 2010 | |
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9. Internationaler Kongress Molded Interconnect Devices |
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Integrierte Entwicklung neuer Produkt- und Produktionstechnologien für räumliche spritzgegossene Schaltungsträger (3D MID) |