Niklas Piechulek – FAPS – Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Ankenbrand M., Panusch D., Piechulek N., Gold G., Helmreich K., Franke J.:
Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas
23rd International Conference on Electronics Packaging, ICEP 2024 (Toyama, JPN, 17. April 2024 - 20. April 2024)
In: 2024 International Conference on Electronics Packaging, ICEP 2024 2024
DOI: 10.23919/ICEP61562.2024.10535565
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Ankenbrand M., Piechulek N., Mutlu E., Franke J.:
Feasibility and Performance of Fully Additive Manufactured Light Bulbs
26th Electronics Packaging Technology Conference, EPTC 2024 (Singapore, SGP, 3. Dezember 2024 - 6. Dezember 2024)
In: Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (Hrsg.): Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 2024
DOI: 10.1109/EPTC62800.2024.10909948
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Fröhlich J., Piechulek N., Nguyen HG., Franke J., Jurgenhake C.:
Reliable and Automated Connection of Printed Electronics to the Aviation Electrical System
2024 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2024 (Kona, Big Island, HI, USA, 29. Januar 2024 - 1. Februar 2024)
In: 2024 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2024 2024
DOI: 10.23919/PanPacific60013.2024.10436443
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Piechulek N., Ankenbrand M., Xu L., Fröhlich J., Nguyen H., Bründl P., Franke J.:
Innovations and Challenges in Laser Direct Structured Mechatronic Integrated Devices for Aviation: Material Development, Component Design, and Additive Manufacturing
26th Electronics Packaging Technology Conference, EPTC 2024 (Singapore, SGP, 3. Dezember 2024 - 6. Dezember 2024)
In: Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (Hrsg.): Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 2024
DOI: 10.1109/EPTC62800.2024.10909947
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2023

Fröhlig S., Nguyen HG., Piechulek N., Franke J.:
Innovative robot tool for full-automatic handling and wiring of deformable linear cables
56th CIRP International Conference on Manufacturing Systems, CIRP CMS 2023 (Cape Town, ZAF, 24. Oktober 2023 - 26. Oktober 2023)
In: Khumbulani Mpofu, Natasha Sacks, Oliver Damm (Hrsg.): Procedia CIRP 2023
DOI: 10.1016/j.procir.2023.12.006
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2022

Thielen N., Pan W., Piechulek N., Voigt C., Meier S., Schmidt K., Franke J.:
Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. Dezember 2022 - 9. Dezember 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013210
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Utsch D., Piechulek N., Franke J.:
Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity
45th International Spring Seminar on Electronics Technology (ISSE) (Wien, 11. Mai 2022 - 15. Mai 2022)
DOI: 10.1109/ISSE54558.2022.9812778
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2020

Fröhlig S., Piechulek N., Friedlein M., Süß-Wolf R., Schmidt L., Kuhn M., Wang L., Hefner F., Heisler P., Fröhlich J., Meiners M., Franke J.:
Innovative signal and power connection solutions for alternative powertrain concepts
In: 2020 10th International Electric Drives Production Conference (EDPC) 2020
DOI: 10.1109/EDPC51184.2020.9388180
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