2025

• Mahr F., Freese G., Meier S., Kratsch C., Raum C., Thielen N., Franke J., Risch F.:
  Optimizing Semantic Search in Industrial Knowledge Retrieval: A Novel SHAP-Based Attention Mask Modification Approach
  2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (Utrecht, 6. April 2025 - 9. April 2025)
  In: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), New York City: 2025
  DOI: 10.1109/EuroSimE65125.2025.11006545
  BibTeX: Download
• Meier S., Raut PN., Mahr F., Thielen N., Franke J., Risch F.:
  Structured knowledge-based causal discovery: Agentic streams of thought
  In: Information Processing & Management 62 (2025), Art.Nr.: 104202
  ISSN: 0306-4573
  DOI: 10.1016/j.ipm.2025.104202
  BibTeX: Download

2024

• Mahr F., Angeli G., Sindel T., Schmidt K., Franke J.:
  A Reference Architecture for Deploying Large Language Model Applications in Industrial Environments
  2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Sibiu, 16. Oktober 2024 - 18. Oktober 2024)
  In: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2024
  DOI: 10.1109/SIITME63973.2024.10814877
  BibTeX: Download
• Mahr F., Schmidt K., Thielen N., Sindel T., Franke J.:
  Optimizing Machine Learning Performance via Dataset Generation for X-ray Image Classification
  2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (Catania, 7. April 2024 - 10. April 2024)
  In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), New York City: 2024
  DOI: 10.1109/EuroSimE60745.2024.10491564
  BibTeX: Download
• Sindel T., Thielen N., Mahr F., Reichenstein T., Erdogan H., Franke J.:
  Data-Driven Bed of Nails Wear Analysis for the in-Circuit-Testing of Electronic Modules
  2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation (ETFA) (Padova, 10. September 2024 - 13. September 2024)
  In: 2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation (ETFA), New York City: 2024
  DOI: 10.1109/ETFA61755.2024.10710880
  BibTeX: Download