2025

• Gökçen A., Ockel M., Petersen M., Thielen N., Franke J., Risch F.:
  Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity
  ITSC 2025 (Vancouverr, 5. Mai 2025 - 8. Mai 2025)
  In: Thermal Spray 2025: Proceedings from the International Thermal Spray Conference 2025
  DOI: 10.31399/asm.cp.itsc2025p0192
  BibTeX: Download
• Mahr F., Freese G., Meier S., Kratsch C., Raum C., Thielen N., Franke J., Risch F.:
  Optimizing Semantic Search in Industrial Knowledge Retrieval: A Novel SHAP-Based Attention Mask Modification Approach
  2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (Utrecht, 6. April 2025 - 9. April 2025)
  In: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), New York City: 2025
  DOI: 10.1109/EuroSimE65125.2025.11006545
  BibTeX: Download
• Ockel M., Albrecht I., Gökçen A., Thielen N., Franke J., Risch F.:
  Influence of Hydrogen-Enhanced Annealing on the Morphology of Atmospheric Plasma Sprayed Copper
  Thermal Spray 2025 (Vancouver, 6. Mai 2015 - 8. Mai 2025)
  In: Thermal Spray 2025: Proceedings from the International Thermal Spray Conference 2025
  DOI: 10.31399/asm.cp.itsc2025p0186
  BibTeX: Download
• Rachinger B., Thielen N., Meier S., Franke J., Risch F.:
  Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
  IPC APEX EXPO 2025 (Anaheim, Kalifornien, 18. März 2025 - 20. März 2025)
  In: IPC APEX EXPO 2025 Technical Conference Proceedings, Bannockburn, Illinois: 2025
  BibTeX: Download
• Thielen N., Braun J., Rachinger B., Franke J., Risch F., Reinhardt A.:
  Improving Data Augmentation in Deep Learning-Based THT Solder Joint Classification with Synthetic Data and Active Learning
  2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025 (Maui, HI, 27. Januar 2025 - 30. Januar 2025)
  In: 2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific) 2025
  DOI: 10.23919/PanPacific65826.2025.10908927
  BibTeX: Download

2024

• Mahr F., Schmidt K., Thielen N., Sindel T., Franke J.:
  Optimizing Machine Learning Performance via Dataset Generation for X-ray Image Classification
  2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (Catania, 7. April 2024 - 10. April 2024)
  In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), New York City: 2024
  DOI: 10.1109/EuroSimE60745.2024.10491564
  BibTeX: Download
• Ockel M., Meier S., Stelter O., Thielen N., Bründl P., Franke J.:
  Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process
  2024 32nd Mediterranean Conference on Control and Automation (MED) (Chania, 11. Juni 2024 - 14. Juni 2024)
  In: 2024 32nd Mediterranean Conference on Control and Automation (MED), New York City: 2024
  DOI: 10.1109/MED61351.2024.10566191
  BibTeX: Download
• Sindel T., Thielen N., Mahr F., Reichenstein T., Erdogan H., Franke J.:
  Data-Driven Bed of Nails Wear Analysis for the in-Circuit-Testing of Electronic Modules
  2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation (ETFA) (Padova, 10. September 2024 - 13. September 2024)
  In: 2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation (ETFA), New York City: 2024
  DOI: 10.1109/ETFA61755.2024.10710880
  BibTeX: Download
• Thielen N., Rachinger B., Schröder F., Preitschaft A., Meier S., Seidel R., Reinhardt A., Franke J.:
  Comparative Study on Different Methods to Generate Synthetic Data for the Classification of THT Solder Joints
  2024 1st International Conference on Production Technologies and Systems for E-Mobility (Bamberg, 5. Juni 2024 - 6. Juni 2024)
  In: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS), New York City: 2024
  DOI: 10.1109/EPTS61482.2024.10586740
  BibTeX: Download

2023

• Meier S., Klarmann S., Thielen N., Pfefferer C., Kuhn M., Franke J.:
  A process model for systematically setting up the data basis for data-driven projects in manufacturing
  In: Journal of Manufacturing Systems 71 (2023), S. 1-19
  ISSN: 0278-6125
  DOI: 10.1016/j.jmsy.2023.08.024
  BibTeX: Download
• Seidel R., Rachinger B., Thielen N., Schmidt K., Meier S., Franke J.:
  Development and validation of a digital twin framework for SMT manufacturing
  In: Computers in Industry 145 (2023)
  ISSN: 0166-3615
  DOI: 10.1016/j.compind.2022.103831
  BibTeX: Download
• Thielen N., Wagner M., Meier S., Voigt C., Franke J.:
  Anomaly Detection for Dispensing of Solder Paste on 3D Circuit Carriers Using Machine Learning
  25th Electronics Packaging Technology Conference, EPTC 2023 (Singapore, 5. Dezember 2023 - 8. Dezember 2023)
  In: Andrew Tay, King Jien Chui, Yeow Kheng Lim, Chuan Seng Tan, Sunmi Shin (Hrsg.): Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023 2023
  DOI: 10.1109/EPTC59621.2023.10457873
  BibTeX: Download
• Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
  Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
  International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
  In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
  DOI: 10.1109/ISSE57496.2023.10168387
  BibTeX: Download

2022

• Meier S., Erkan A., Thielen N., Klarmann S., Franke J.:
  Attention-based Image Compression in Sensor Assembly
  28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
  In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
  DOI: 10.1109/SIITME56728.2022.9987988
  BibTeX: Download
• Schwab M., Madeline-Derou C., Klarmann S., Thielen N., Meier S., Franke J., Chintanippu S., Stork W.:
  Multi-Model Machine Learning based Industrial Vision Framework for Assembly Part Quality Control
  27th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022 (Stuttgart, DEU, 6. September 2022 - 9. September 2022)
  In: IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022
  DOI: 10.1109/ETFA52439.2022.9921587
  BibTeX: Download
• Seidel R., Schmidt K., Thielen N., Franke J.:
  Trustworthiness of machine learning models in manufacturing applications using the example of electronics manufacturing processes
  55th CIRP Conference on Manufacturing Systems, CIRP CMS 2022 (Lugano, 29. Juni 2022 - 1. Juli 2022)
  In: Anna Valente, Emanuele Carpanzano, Claudio Boer (Hrsg.): Procedia CIRP 2022
  DOI: 10.1016/j.procir.2022.05.013
  BibTeX: Download
• Thielen N., Pan W., Piechulek N., Voigt C., Meier S., Schmidt K., Franke J.:
  Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013210
  BibTeX: Download

2021

• Hamjah MK., Thielen N., Hagelloch JE., Franke J.:
  Machine Learning Approach towards Quality Control of Aerosol-Jet Printed Polymer Optical Waveguides Material
  2021 IEEE Region 10 Symposium, TENSYMP 2021 (Jeju, 23. August 2021 - 25. August 2021)
  In: TENSYMP 2021 - 2021 IEEE Region 10 Symposium 2021
  DOI: 10.1109/TENSYMP52854.2021.9550899
  BibTeX: Download
• Schmidt K., Rauchensteiner D., Voigt C., Thielen N., Bönig J., Beitinger G., Franke J.:
  An Automated Optical Inspection System for PIP Solder Joint Classification Using Convolutional Neural Networks
  2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (San Diego, CA, 1. Juni 2021 - 4. Juli 2021)
  In: IEEE (Hrsg.): IEEE 2021
  DOI: 10.1109/ECTC32696.2021.00346
  URL: https://ieeexplore.ieee.org/document/9501916
  BibTeX: Download
• Thielen N., Jiang Z., Schmidt K., Seidel R., Voigt C., Reinhardt A., Franke J.:
  Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing
  IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Timisoara)
  In: 2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021), NEW YORK: 2021
  DOI: 10.1109/SIITME53254.2021.9663663
  BibTeX: Download

2020

• Schmidt K., Bönig J., Beitinger G., Thielen N., Franke J.:
  Ein Ansatz zu Qualitätsvorhersage mittels intelligenter SMT-Lötstelleninspektion durch den Einsatz von Maschinellem Lernen
  EBL Fellbach (Fellbach, 18. Februar 2020 - 19. Februar 2020)
  In: VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM) (Hrsg.): GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten 2020
  URL: https://www.vde-verlag.de/buecher/455185/gmm-fb-94-ebl-2020-elektronische-baugruppen-und-leiterplatten.html
  BibTeX: Download
• Schmidt K., Thielen N., Voigt C., Seidel R., Franke J., Milde Y., Bonig J., Beitinger G.:
  Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292292
  BibTeX: Download
• Seidel R., Hassan Amada M., Fuchs J., Thielen N., Schmidt K., Voigt C., Franke J.:
  Data Mining System Architecture for Industrial Internet of Things in Electronics Production
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292282
  BibTeX: Download
• Seidel R., Leibold F., Thielen N., Franke J.:
  Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression
  DOI: 10.1109/ISSE49702.2020.9121028
  URL: https://ieeexplore.ieee.org/document/9121028
  BibTeX: Download
• Seidel R., Thielen N., Schmidt K., Voigt C., Franke J.:
  Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292175
  BibTeX: Download
• Seidel R., Thielen N., Voigt C., Franke J.:
  Thermische Beurteilung von THT-Lötstellendesigns für die IPC-konforme Kontaktierung durch Selektivwellenlöten
  EBL 2020 (Fellbach, 18. Februar 2020 - 19. Februar 2020)
  BibTeX: Download
• Seidel R., Volland J., Thielen N., Voigt C., Franke J.:
  Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement
  ISSE 2020
  DOI: 10.1109/ISSE49702.2020.9120918
  BibTeX: Download
• Thielen N., Schmidt K., Seidel R., Franke J.:
  Maschinelles Lernen in der Elektronikproduktion: Herausforderungen und Anwendungsmöglichkeiten
  EBL 2020 – Elektronische Baugruppen und Leiterplatten - 10. DVS/GMM-Tagung (Fellbach, 18. Februar 2020 - 19. Februar 2020)
  In: VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM) (Hrsg.): GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten 2020
  BibTeX: Download
• Thielen N., Werner D., Schmidt K., Seidel R., Reinhardt A., Franke J.:
  A Machine Learning Based Approach to Detect False Calls in SMT Manufacturing
  43rd International Spring Seminar on Electronics Technology, ISSE 2020 (Demanovska Valley, 14. Mai 2020 - 15. Mai 2020)
  In: Proceedings of the International Spring Seminar on Electronics Technology 2020
  DOI: 10.1109/ISSE49702.2020.9121044
  BibTeX: Download