Aktuelle studentische Arbeiten Passende News Publikationen 2024 Mahr F. , Schmidt K. , Thielen N. , Sindel T. , Franke J. :Optimizing Machine Learning Performance via Dataset Generation for X-ray Image Classification 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (Catania , 7. April 2024 - 10. April 2024 )In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , New York City : 2024 DOI: 10.1109/EuroSimE60745.2024.10491564 BibTeX: Download Ockel M. , Meier S. , Stelter O. , Thielen N. , Bründl P. , Franke J. :Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process 2024 32nd Mediterranean Conference on Control and Automation (MED) (Chania , 11. Juni 2024 - 14. Juni 2024 )In: 2024 32nd Mediterranean Conference on Control and Automation (MED) , New York City : 2024 DOI: 10.1109/MED61351.2024.10566191 BibTeX: Download 2023 Meier S. , Klarmann S. , Thielen N. , Pfefferer C. , Kuhn M. , Franke J. :A process model for systematically setting up the data basis for data-driven projects in manufacturing In: Journal of Manufacturing Systems 71 (2023 ), S. 1-19 ISSN: 0278-6125 DOI: 10.1016/j.jmsy.2023.08.024 BibTeX: Download Seidel R. , Rachinger B. , Thielen N. , Schmidt K. , Meier S. , Franke J. :Development and validation of a digital twin framework for SMT manufacturing In: Computers in Industry 145 (2023 )ISSN: 0166-3615 DOI: 10.1016/j.compind.2022.103831 BibTeX: Download Voigt C. , Petersen M. , Thielen N. , Utsch D. , Häußler F. , Kirchberger M. , Franke J. :Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components International Spring Seminar on Electronics Technology (Timisoara , 14. Mai 2023 - 17. Juli 2023 )In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023 DOI: 10.1109/ISSE57496.2023.10168387 BibTeX: Download 2022 Meier S. , Erkan A. , Thielen N. , Klarmann S. , Franke J. :Attention-based Image Compression in Sensor Assembly 28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU , 26. Oktober 2022 - 29. Oktober 2022 )In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022 DOI: 10.1109/SIITME56728.2022.9987988 BibTeX: Download Schwab M. , Madeline-Derou C. , Klarmann S. , Thielen N. , Meier S. , Franke J. , Chintanippu S. , Stork W. :Multi-Model Machine Learning based Industrial Vision Framework for Assembly Part Quality Control 27th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022 (Stuttgart, DEU , 6. September 2022 - 9. September 2022 )In: IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022 DOI: 10.1109/ETFA52439.2022.9921587 BibTeX: Download Seidel R. , Schmidt K. , Thielen N. , Franke J. :Trustworthiness of machine learning models in manufacturing applications using the example of electronics manufacturing processes 55th CIRP Conference on Manufacturing Systems, CIRP CMS 2022 (Lugano , 29. Juni 2022 - 1. Juli 2022 )In: Anna Valente, Emanuele Carpanzano, Claudio Boer (Hrsg.): Procedia CIRP 2022 DOI: 10.1016/j.procir.2022.05.013 BibTeX: Download Thielen N. , Pan W. , Piechulek N. , Voigt C. , Meier S. , Schmidt K. , Franke J. :Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production 24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP , 7. Dezember 2022 - 9. Dezember 2022 )In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022 DOI: 10.1109/EPTC56328.2022.10013210 BibTeX: Download 2021 Hamjah MK. , Thielen N. , Hagelloch JE. , Franke J. :Machine Learning Approach towards Quality Control of Aerosol-Jet Printed Polymer Optical Waveguides Material 2021 IEEE Region 10 Symposium, TENSYMP 2021 (Jeju , 23. August 2021 - 25. August 2021 )In: TENSYMP 2021 - 2021 IEEE Region 10 Symposium 2021 DOI: 10.1109/TENSYMP52854.2021.9550899 BibTeX: Download Schmidt K. , Rauchensteiner D. , Voigt C. , Thielen N. , Bönig J. , Beitinger G. , Franke J. :An Automated Optical Inspection System for PIP Solder Joint Classification Using Convolutional Neural Networks 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (San Diego, CA , 1. Juni 2021 - 4. Juli 2021 )In: IEEE (Hrsg.): IEEE 2021 DOI: 10.1109/ECTC32696.2021.00346 URL: https://ieeexplore.ieee.org/document/9501916 BibTeX: Download Thielen N. , Jiang Z. , Schmidt K. , Seidel R. , Voigt C. , Reinhardt A. , Franke J. :Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Timisoara )In: 2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021) , NEW YORK : 2021 DOI: 10.1109/SIITME53254.2021.9663663 BibTeX: Download 2020 Schmidt K. , Bönig J. , Beitinger G. , Thielen N. , Franke J. :Ein Ansatz zu Qualitätsvorhersage mittels intelligenter SMT-Lötstelleninspektion durch den Einsatz von Maschinellem Lernen EBL Fellbach (Fellbach , 18. Februar 2020 - 19. Februar 2020 )In: VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM) (Hrsg.): GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten 2020 URL: https://www.vde-verlag.de/buecher/455185/gmm-fb-94-ebl-2020-elektronische-baugruppen-und-leiterplatten.html BibTeX: Download Schmidt K. , Thielen N. , Voigt C. , Seidel R. , Franke J. , Milde Y. , Bonig J. , Beitinger G. :Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti , 21. Oktober 2020 - 24. Oktober 2020 )In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020 DOI: 10.1109/SIITME50350.2020.9292292 BibTeX: Download Seidel R. , Hassan Amada M. , Fuchs J. , Thielen N. , Schmidt K. , Voigt C. , Franke J. :Data Mining System Architecture for Industrial Internet of Things in Electronics Production 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti , 21. Oktober 2020 - 24. Oktober 2020 )In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020 DOI: 10.1109/SIITME50350.2020.9292282 BibTeX: Download Seidel R. , Leibold F. , Thielen N. , Franke J. :Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression DOI: 10.1109/ISSE49702.2020.9121028 URL: https://ieeexplore.ieee.org/document/9121028 BibTeX: Download Seidel R. , Thielen N. , Schmidt K. , Voigt C. , Franke J. :Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti , 21. Oktober 2020 - 24. Oktober 2020 )In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020 DOI: 10.1109/SIITME50350.2020.9292175 BibTeX: Download Seidel R. , Thielen N. , Voigt C. , Franke J. :Thermische Beurteilung von THT-Lötstellendesigns für die IPC-konforme Kontaktierung durch Selektivwellenlöten EBL 2020 (Fellbach , 18. Februar 2020 - 19. Februar 2020 ) BibTeX: Download Seidel R. , Volland J. , Thielen N. , Voigt C. , Franke J. :Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement ISSE 2020 DOI: 10.1109/ISSE49702.2020.9120918 BibTeX: Download Thielen N. , Schmidt K. , Seidel R. , Franke J. :Maschinelles Lernen in der Elektronikproduktion: Herausforderungen und Anwendungsmöglichkeiten EBL 2020 – Elektronische Baugruppen und Leiterplatten - 10. DVS/GMM-Tagung (Fellbach , 18. Februar 2020 - 19. Februar 2020 )In: VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM) (Hrsg.): GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten 2020 BibTeX: Download Thielen N. , Werner D. , Schmidt K. , Seidel R. , Reinhardt A. , Franke J. :A Machine Learning Based Approach to Detect False Calls in SMT Manufacturing 43rd International Spring Seminar on Electronics Technology, ISSE 2020 (Demanovska Valley , 14. Mai 2020 - 15. Mai 2020 )In: Proceedings of the International Spring Seminar on Electronics Technology 2020 DOI: 10.1109/ISSE49702.2020.9121044 BibTeX: Download
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