Mario Sprenger, M. Sc.
Aktuelle studentische Arbeiten
- BA/PA/MA (extern) bei Vitesco im Bereich Power Electronics / E-Mobility in Nürnberg: Packaging und Verkapselung automobiler Leistungselektronik
- Sauberkeitsanforderungen an AL-Druckguss Klebeflächen (Bereich E-Mobility; extern bei Vitesco in Nürnberg)
- Evaluierung von Packaging-Konzepten für automobile Wechselrichter / Inverter
- Rechnergestützte Auswahl von Epoxid-Verkapselungsmassen für automobile Wechselrichter
- Lebensdaueroptimierung von Draht-Bondverbindungen in automobilen Wechselrichtern mittels thermo-mechanischer Simulation
Passende News
2023
- 26.05.2023: CSU-Generalsekretär Martin Huber zu Besuch am FAPS
- 19.04.2023: Best Paper Award der EuroSimE23 für Marcel Sippel
2022
- 02.12.2022: Vorstellung der Initiative E|Road-Center beim 1. Netzwerkempfang des Cleantech Innovation Parks mit dem bayerischen Ministerpräsidenten Dr. Markus Söder
- 04.11.2022: Best Presentation Award der SIITME 2022 für Christoph Hecht
- 20.-21.07.2022: FAPS-Seminar zu "Produktionsprozessen in der Elektronik" erfolgreich durchgeführt
2020
Publikationen
2023
Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, AUT, 16. April 2023 - 19. April 2023)
In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
DOI: 10.1109/EuroSimE56861.2023.10100802
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Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, 16. April 2023 - 19. April 2023)
In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
DOI: 10.1109/EuroSimE56861.2023.10100795
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2022
Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
DOI: 10.1109/SIITME56728.2022.9987997
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High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939424
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Reliability of lead-free solders for die attach in automotive power modules
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013246
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Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 (Sibiu, 13. September 2022 - 16. September 2022)
In: 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings 2022
DOI: 10.1109/ESTC55720.2022.9939542
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Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
In: IEEE (Hrsg.): Electronics Packaging Technology Conference (EPTC) 2022
DOI: 10.1109/EPTC56328.2022.10013275
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Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
CIPS 2022 (Berlin, 15. März 2022 - 17. März 2022)
In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
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Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (St Julian, 25. April 2022 - 27. April 2022)
In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 2022
DOI: 10.1109/EuroSimE54907.2022.9758880
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Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013218
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2019
MultOpt++: a fast regression-based model for the development of compositions with high robustness against scatter of element concentrations
In: Modelling and Simulation in Materials Science and Engineering 27 (2019)
ISSN: 0965-0393
DOI: 10.1088/1361-651X/aaf0b8
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MultOpt++: a fast regression-based model for the constraint violation fraction due to composition uncertainties
In: Modelling and Simulation in Materials Science and Engineering 27 (2019)
ISSN: 0965-0393
DOI: 10.1088/1361-651X/aaf01e
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