Aktuelle studentische Arbeiten
- Evaluierung von Packaging-Konzepten für automobile Wechselrichter / Inverter
- Rechnergestützte Auswahl von Epoxid-Verkapselungsmassen für automobile Wechselrichter
- Lebensdaueroptimierung von Draht-Bondverbindungen in automobilen Wechselrichtern mittels thermo-mechanischer Simulation
- BA/PA/MA (extern) bei Vitesco im Bereich Power Electronics / E-Mobility in Nürnberg: Packaging und Verkapselung automobiler Leistungselektronik
Passende News
2024
- 01.09.2024: ECPE Joint Research Projekt zu recyclingfähigen Verkapselungsmaterialien für Leistungselektroniken gestartet
- 11.06.2024: Einbringung eines durch Semikron Danfoss leihweise bereitgestellten Lötöfens in unsere Laborhalle auf AEG
- 17.05.2024: Excellent Paper Award der ISSE 2024 für Christoph Hecht
2023
- 26.05.2023: CSU-Generalsekretär Martin Huber zu Besuch am FAPS
- 19.04.2023: Best Paper Award der EuroSimE23 für Marcel Sippel
2022
- 02.12.2022: Vorstellung der Initiative E|Road-Center beim 1. Netzwerkempfang des Cleantech Innovation Parks mit dem bayerischen Ministerpräsidenten Dr. Markus Söder
- 04.11.2022: Best Presentation Award der SIITME 2022 für Christoph Hecht
- 20.-21.07.2022: FAPS-Seminar zu "Produktionsprozessen in der Elektronik" erfolgreich durchgeführt
2020
Publikationen
2024
Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 (Catania, 7. April 2024 - 10. April 2024)
In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 2024
DOI: 10.1109/EuroSimE60745.2024.10491541
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Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle
In: Microelectronics Reliability 155 (2024), Art.Nr.: 115348
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2024.115348
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Influence of hard encapsulation onto reliability of soldered die-attach in power modules
13th International Conference on Integrated Power Electronics Systems, CIPS 2024 (Dusseldorf, DEU, 12. März 2024 - 14. März 2024)
In: ETG-Fachbericht 2024
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2023
Additive metallization of alumina with copper-titanium powder blends for power electronic applications
In: Advancing Microelectronics 2023 (2023), S. 129-134
ISSN: 2222-8748
DOI: 10.4071/001c.94698
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Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
24th European Microelectronics and Packaging Conference, EMPC 2023 (Hinxton, 11. September 2024 - 14. November 2024)
In: IMAPSource Proceedings 2023 (EMPC) 2023
DOI: 10.23919/EMPC55870.2023.10418396
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Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, AUT, 16. April 2023 - 19. April 2023)
In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
DOI: 10.1109/EuroSimE56861.2023.10100802
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Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, 16. April 2023 - 19. April 2023)
In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
DOI: 10.1109/EuroSimE56861.2023.10100795
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Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
2023 15th International Congress Mechatronic Integration Discourse (Amberg, 21. Juni 2023 - 22. Juni 2023)
In: 2023 15th International Congress Mechatronic Integration Discourse (MID), New York: 2023
DOI: 10.1109/MID59615.2023.10461318
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2022
Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
DOI: 10.1109/SIITME56728.2022.9987997
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High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939424
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Reliability of lead-free solders for die attach in automotive power modules
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013246
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Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 (Sibiu, 13. September 2022 - 16. September 2022)
In: 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings 2022
DOI: 10.1109/ESTC55720.2022.9939542
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Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
In: IEEE (Hrsg.): Electronics Packaging Technology Conference (EPTC) 2022
DOI: 10.1109/EPTC56328.2022.10013275
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Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
CIPS 2022 (Berlin, 15. März 2022 - 17. März 2022)
In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
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Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (St Julian, 25. April 2022 - 27. April 2022)
In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 2022
DOI: 10.1109/EuroSimE54907.2022.9758880
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Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013218
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2019
MultOpt++: a fast regression-based model for the development of compositions with high robustness against scatter of element concentrations
In: Modelling and Simulation in Materials Science and Engineering 27 (2019)
ISSN: 0965-0393
DOI: 10.1088/1361-651X/aaf0b8
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MultOpt++: a fast regression-based model for the constraint violation fraction due to composition uncertainties
In: Modelling and Simulation in Materials Science and Engineering 27 (2019)
ISSN: 0965-0393
DOI: 10.1088/1361-651X/aaf01e
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