2025

• Sprenger M., Fegus M., Ockel M., Hechtel M., Goth C., Franke J., Risch F.:
  Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules
  2025 International Spring Seminar on Electronics Technology (ISSE) (, 14. Mai 2025 - 18. Mai 2025)
  In: 2025 International Spring Seminar on Electronics Technology (ISSE) 2025
  DOI: 10.1109/ISSE65583.2025.11120973
  BibTeX: Download

2024

• Forndran F., Sprenger M., Barrera JR., Steinau M., Roellig M., Muench S.:
  Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles
  25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 (Catania, 7. April 2024 - 10. April 2024)
  In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 2024
  DOI: 10.1109/EuroSimE60745.2024.10491541
  BibTeX: Download
• Hecht C., Sprenger M., Franke J.:
  Laser powder bed fusion of titanium alloyed copper powder for power electronic substrates
  47th International Spring Seminar on Electronics Technology, ISSE 2024 (Prague, CZE, 15. Mai 2024 - 19. Mai 2024)
  In: Proceedings of the International Spring Seminar on Electronics Technology 2024
  DOI: 10.1109/ISSE61612.2024.10603471
  BibTeX: Download
• Sippel M., Tan YF., Schmidt R., Botazzoli P., Sprenger M., Franke J.:
  Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle
  In: Microelectronics Reliability 155 (2024), Art.Nr.: 115348
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2024.115348
  BibTeX: Download
• Sprenger M., Forndran F., Öztürk B., Sippel M., Ockel M., Goth C., Franke J.:
  Influence of hard encapsulation onto reliability of soldered die-attach in power modules
  13th International Conference on Integrated Power Electronics Systems, CIPS 2024 (Dusseldorf, DEU, 12. März 2024 - 14. März 2024)
  In: ETG-Fachbericht 2024
  BibTeX: Download

2023

• Hecht C., Häußler F., Schadow E., Stoll T., Sprenger M., Franke J.:
  Additive metallization of alumina with copper-titanium powder blends for power electronic applications
  In: Advancing Microelectronics 2023 (2023), S. 129-134
  ISSN: 2222-8748
  DOI: 10.4071/001c.94698
  BibTeX: Download
• Hecht C., Schadow E., Sprenger M., Häußler F., Stoll T., Franke J.:
  Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
  24th European Microelectronics and Packaging Conference, EMPC 2023 (Hinxton, 11. September 2024 - 14. November 2024)
  In: IMAPSource Proceedings 2023 (EMPC) 2023
  DOI: 10.23919/EMPC55870.2023.10418396
  BibTeX: Download
• Sippel M., Tan YF., Schmidt R., Botazzoli P., Sprenger M., Franke J.:
  Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds
  24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, AUT, 16. April 2023 - 19. April 2023)
  In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
  DOI: 10.1109/EuroSimE56861.2023.10100802
  BibTeX: Download
• Sprenger M., Kramer M., Tolyschew E., Steinau M., Renner D., Ottinger B., Franke J.:
  Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization
  24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, 16. April 2023 - 19. April 2023)
  In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
  DOI: 10.1109/EuroSimE56861.2023.10100795
  BibTeX: Download
• Utsch D., Häußler F., Sprenger M., Zirn J., Franke J.:
  Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
  2023 15th International Congress Mechatronic Integration Discourse (Amberg, 21. Juni 2023 - 22. Juni 2023)
  In: 2023 15th International Congress Mechatronic Integration Discourse (MID), New York: 2023
  DOI: 10.1109/MID59615.2023.10461318
  BibTeX: Download

2022

• Hecht C., Slama JN., Sprenger M., Haubler F., Sippel M., Franke J.:
  Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
  28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
  In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
  DOI: 10.1109/SIITME56728.2022.9987997
  BibTeX: Download
• Häußler F., Sippel M., Sprenger M., Liu L., Muckelbauer M., Franke J.:
  High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
  2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
  DOI: 10.1109/ESTC55720.2022.9939424
  BibTeX: Download
• Ottinger B., Holverscheid J., Konig S., Jerichow E., Lunz S., Sprenger M., Muller L., Goth C., Franke J.:
  Reliability of lead-free solders for die attach in automotive power modules
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013246
  BibTeX: Download
• Sippel M., Hassel S., Schmidt R., Sprenger M., Hecht C., Franke J.:
  Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
  9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 (Sibiu, 13. September 2022 - 16. September 2022)
  In: 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings 2022
  DOI: 10.1109/ESTC55720.2022.9939542
  BibTeX: Download
• Sippel M., Schmidt R., Kaesbauer M., Sprenger M., Hensel A., Franke J.:
  Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test
  2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
  In: IEEE (Hrsg.): Electronics Packaging Technology Conference (EPTC) 2022
  DOI: 10.1109/EPTC56328.2022.10013275
  BibTeX: Download
• Sprenger M., Forndran F., Ottinger B., Braun T., Franke J.:
  Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
  CIPS 2022 (Berlin, 15. März 2022 - 17. März 2022)
  In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
  BibTeX: Download
• Sprenger M., Forndran F., Ottinger B., Dammann T., Erben B., Sippel M., Franke J.:
  Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation
  23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (St Julian, 25. April 2022 - 27. April 2022)
  In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 2022
  DOI: 10.1109/EuroSimE54907.2022.9758880
  BibTeX: Download
• Sprenger M., Noll N., Hecht C., De Greiff M., Müller L., Franke J.:
  Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013218
  BibTeX: Download

2019

• Müller A., Roslyakova I., Sprenger M., Git P., Rettig R., Markl M., Körner C., Singer R.:
  MultOpt++: a fast regression-based model for the development of compositions with high robustness against scatter of element concentrations
  In: Modelling and Simulation in Materials Science and Engineering 27 (2019)
  ISSN: 0965-0393
  DOI: 10.1088/1361-651X/aaf0b8
  BibTeX: Download
• Müller A., Sprenger M., Ritter N., Rettig R., Markl M., Körner C., Singer R.:
  MultOpt++: a fast regression-based model for the constraint violation fraction due to composition uncertainties
  In: Modelling and Simulation in Materials Science and Engineering 27 (2019)
  ISSN: 0965-0393
  DOI: 10.1088/1361-651X/aaf01e
  BibTeX: Download