Daniel Utsch, M. Sc.
Passende News
2023
- 28.11.2023: Erfolgreicher Abschluss des Projekts A4I-PE3D: "Additive4Industry - Printed electronics on 3D-substrates"
- 07.11.-10.11.2023: FAPS auf der Formnext 2023 präsent
- 21.06.-22.06.2023: FAPS auf MID Congress in Amberg vertreten
- 01.04.2023: Forschungsprojekt "MultiPower" gestartet
2021
2020
Publikationen
2023
Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring
SMTA Pan Pacific Microelectronics Symposium 2023 (Kauai, 30. Januar 2023 - 1. Februar 2023)
In: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2023 2023
URL: https://smta.org/page/knowledge-search#conference-proceedings/proceedings-by-year/5e46de4c222bfe08592ecfd5/view-publication-details5/64517354b4950300283478bd/entry-details4/645174ed0e46690d6145b460/
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Mechanical qualification and microstructural analysis of alumina produced by material extrusion
In: Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing (2023), S. 145456
ISSN: 0921-5093
DOI: 10.1016/j.msea.2023.145456
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Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
46th International Spring Seminar on Electronics Technology (Timisoara, 10. Mai 2023 - 14. Mai 2023)
DOI: 10.1109/ISSE57496.2023.10168526
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Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
DOI: 10.1109/ISSE57496.2023.10168387
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2022
Additive4Industry - Printed electronics on 3D substrates. Mit keramischen Materialien zu temperaturbeständigeren elektronischen Baugruppen
In: Cluster Mechatronik & Automation, Teil der Bayern Innovativ Bayerische Gesellschaft für Innovation und Wissenstransfer mbH (Hrsg.): mechatroniknews, Nürnberg: , 2022, S. 2 - 4
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Herstellung räumlicher Schaltungsträger mit keramischen Materialien mittels digitaler Fertigungsverfahren
11. DVS/GMM-Fachtagung - Elektronische Baugruppen und Leiterplatten EBL 2022 (Fellbach, 14. Juni 2022 - 15. Juni 2022)
In: DVS Media GmbH (Hrsg.): Elektronische Baugruppen und Leiterplatten EBL 2022 2022
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Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity
45th International Spring Seminar on Electronics Technology (ISSE) (Wien, 11. Mai 2022 - 15. Mai 2022)
DOI: 10.1109/ISSE54558.2022.9812778
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Electromagnetic Actuators Suitable for High Temperatures Using Thin Aluminum Foil as Conductor
12th International Electric Drives Production Conference, EDPC 2022 (Virtual, Online, DEU, 29. November 2022 - 30. November 2022)
In: 2022 12th International Electric Drives Production Conference, EDPC 2022 - Proceedings 2022
DOI: 10.1109/EDPC56367.2022.10019743
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2020
Optimization of wire harness assembly using human-robot-collaboration
8th CIRP Conference of Assembly Technology and Systems, CATS 2020 (Athens, 29. September 2020 - 1. Oktober 2020)
In: Sotiris Makris (Hrsg.): Procedia CIRP 2020
DOI: 10.1016/j.procir.2020.05.235
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A system for human-in-the-loop simulation of industrial collaborative robot applications
16th IEEE International Conference on Automation Science and Engineering, CASE 2020 (Hong Kong, 20. August 2020 - 21. August 2020)
In: IEEE International Conference on Automation Science and Engineering 2020
DOI: 10.1109/CASE48305.2020.9216766
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