Felix Häußler, M. Sc.
Aktuelle studentische Arbeiten
Passende News
2022
- 04.11.2022: Best Presentation Award der SIITME 2022 für Christoph Hecht
- 31.08.2022: Internationale Forschung am Lehrstuhl FAPS
- 17.02.2022: Patent zur Additiven Fertigung eines leistungselektronischen Schaltungsträgers mittels laserbasiertem selektiven Laserschmelzen erteilt
2021
2020
2018
Publikationen
2023
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
In: Journal of Electronic Packaging 145 (2023)
ISSN: 1043-7398
DOI: 10.1115/1.4056992
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Aerosol-Jet-Printed Encapsulation of Organic Photovoltaics
In: Advanced Engineering Materials (2023)
ISSN: 1438-1656
DOI: 10.1002/adem.202300322
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Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
46th International Spring Seminar on Electronics Technology (Timisoara, 10. Mai 2023 - 14. Mai 2023)
DOI: 10.1109/ISSE57496.2023.10168526
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Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
DOI: 10.1109/ISSE57496.2023.10168387
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2022
Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939487
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High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939424
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2021
Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach
PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (Nürnberg, 7. Juli 2021 - 8. Juli 2021)
URL: https://ieeexplore.ieee.org/document/9472281
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2020
Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices
43rd International Spring Seminar on Electronics Technology (ISSE) (Demanovska Valley, Slovakia, 14. Mai 2020 - 15. Mai 2020)
In: 2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), NEW YORK: 2020
DOI: 10.1109/ISSE49702.2020.9121136
URL: https://ieeexplore.ieee.org/document/9121136
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Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging
In: International Symposium on Microelectronics 2020 (2020), S. 000140-000145
ISSN: 2380-4505
DOI: 10.4071/2380-4505-2020.1.000140
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2019
Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments
2019 International Conference on Electronics Packaging (ICEP) (Niigata, Japan, 17. April 2019 - 20. April 2019)
In: 2019 International Conference on Electronics Packaging (ICEP) 2019
DOI: 10.23919/ICEP.2019.8733496
URL: https://ieeexplore.ieee.org/document/8733496
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