Felix Häußler

Publikationen

2024

Bartz M., Häußler F., Halmos F., Ankenbrand M., Jüttner M., Franke J., Wartzack S.:
Strain measurement on rolling bearings using sensors applied by aerosol-based deposition
Bearing World (Würzburg, 25. Juni 2024 - 26. Juni 2024)
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Utsch D., Sippel M., Voigt C., Häußler F., Franke J.:
Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication
In: Power Electronic Devices and Components 8 (2024), Art.Nr.: 100067
ISSN: 2772-3704
DOI: 10.1016/j.pedc.2024.100067
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2023

Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
In: Journal of Electronic Packaging 145 (2023)
ISSN: 1043-7398
DOI: 10.1115/1.4056992
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Bartz M., Häußler F., Halmos F., Ankenbrand M., Jüttner M., Roudenko J., Wirsching S., Reichenberger M., Franke J., Wartzack S.:
Use of Printed Sensors to Measure Strain in Rolling Bearings under Isolated Boundary Conditions
In: Lubricants 11 (2023), S. 424
ISSN: 2075-4442
DOI: 10.3390/lubricants11100424
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Basu R., Siah KS., Distler A., Häußler F., Franke J., Brabec C., Egelhaaf HJ.:
Aerosol-Jet-Printed Encapsulation of Organic Photovoltaics
In: Advanced Engineering Materials (2023)
ISSN: 1438-1656
DOI: 10.1002/adem.202300322
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Hecht C., Häußler F., Schadow E., Stoll T., Sprenger M., Franke J.:
Additive metallization of alumina with copper-titanium powder blends for power electronic applications
In: Advancing Microelectronics 2023 (2023), S. 129-134
ISSN: 2222-8748
DOI: 10.4071/001c.94698
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Hecht C., Schadow E., Sprenger M., Häußler F., Stoll T., Franke J.:
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
24th European Microelectronics and Packaging Conference, EMPC 2023 (Hinxton, 11. September 2024 - 14. November 2024)
In: IMAPSource Proceedings 2023 (EMPC) 2023
DOI: 10.23919/EMPC55870.2023.10418396
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Roudenko J., Häußler F., Franke J., Reichenberger M.:
Digitally printed strain gauges on 3D metallic objects for pressure sensing
15th International Congress Mechatronic Integration Discourse, MID 2023 (Amberg, 21. Juni 2023 - 22. Juni 2023)
In: 2023 15th International Congress Mechatronic Integration Discourse (MID) 2023
DOI: 10.1109/MID59615.2023.10461323
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Utsch D., Häußler F., Sprenger M., Zirn J., Franke J.:
Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
2023 15th International Congress Mechatronic Integration Discourse (Amberg, 21. Juni 2023 - 22. Juni 2023)
In: 2023 15th International Congress Mechatronic Integration Discourse (MID), New York: 2023
DOI: 10.1109/MID59615.2023.10461318
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Utsch D., Häußler F., Voigt C., Sippel M., Franke J.:
Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
46th International Spring Seminar on Electronics Technology (Timisoara, 10. Mai 2023 - 14. Mai 2023)
DOI: 10.1109/ISSE57496.2023.10168526
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Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
DOI: 10.1109/ISSE57496.2023.10168387
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2022

Bräuer P., Stoll T., Muckelbauer M., Häußler F., Hensel A., Franke J.:
Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939487
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Häußler F., Sippel M., Sprenger M., Liu L., Muckelbauer M., Franke J.:
High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939424
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2021

Häußler F., Schöttner J., Schubert J., Muckelbauer M., Spiecker E., Franke J.:
Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach
PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (Nürnberg, 7. Juli 2021 - 8. Juli 2021)
URL: https://ieeexplore.ieee.org/document/9472281
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2020

Häußler F., Petillon S., Dornheim J., Weser S., Eberhardt W., Zimmermann A., Franke J.:
Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices
43rd International Spring Seminar on Electronics Technology (ISSE) (Demanovska Valley, Slovakia, 14. Mai 2020 - 15. Mai 2020)
In: 2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), NEW YORK: 2020
DOI: 10.1109/ISSE49702.2020.9121136
URL: https://ieeexplore.ieee.org/document/9121136
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Häußler F., Shen S., Petillon S., Weser S., Haybat M., Eberhardt W., Zimmermann A., Franke J.:
Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging
In: International Symposium on Microelectronics 2020 (2020), S. 000140-000145
ISSN: 2380-4505
DOI: 10.4071/2380-4505-2020.1.000140
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2019

Yu Z., Wang S., Letz S., Bayer CF., Häußler F., Schletz A., SUGANUMA K.:
Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments
2019 International Conference on Electronics Packaging (ICEP) (Niigata, Japan, 17. April 2019 - 20. April 2019)
In: 2019 International Conference on Electronics Packaging (ICEP) 2019
DOI: 10.23919/ICEP.2019.8733496
URL: https://ieeexplore.ieee.org/document/8733496
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