2024

• Hecht C., Ockel M., Stoll T., Franke J.:
  Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating
  SPIE LASE (San Francisco)
  In: Proceedings Volume 12876, Laser 3D Manufacturing XI 2024
  DOI: 10.1117/12.3001350
  BibTeX: Download

2023

• Hecht C., Schüller D., Utsch D., Stoll T., Franke J.:
  Investigations on processing copper-titanium powder blends via PBF-LB/M
  In: Lasers in Manufacturing, 2023
  URL: https://wlt.de/sites/default/files/2023-09/Contribution_112.pdf
  BibTeX: Download
• Ockel M., Sippel M., Hecht C., Janisch L., Franke J.:
  A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing
  DOI: 10.1109/EPTC59621.2023.10457786
  BibTeX: Download

2022

• Hecht C., Slama JN., Sprenger M., Haubler F., Sippel M., Franke J.:
  Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
  28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
  In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
  DOI: 10.1109/SIITME56728.2022.9987997
  BibTeX: Download
• Sippel M., Hassel S., Schmidt R., Sprenger M., Hecht C., Franke J.:
  Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
  9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 (Sibiu, 13. September 2022 - 16. September 2022)
  In: 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings 2022
  DOI: 10.1109/ESTC55720.2022.9939542
  BibTeX: Download
• Sprenger M., Noll N., Hecht C., De Greiff M., Müller L., Franke J.:
  Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013218
  BibTeX: Download