2023

• Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
  Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
  In: Journal of Electronic Packaging 145 (2023)
  ISSN: 1043-7398
  DOI: 10.1115/1.4056992
  BibTeX: Download
• Ottinger B., Holverscheid J., König S., Brunner A., Müller L., Goth C., Franke J.:
  Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as die-attach method for automotive power modules
  International Conference and Exhibition on High Temperature Electronics (HITEC 2023) (Albuquerque, 18. April 2023 - 20. April 2023)
  BibTeX: Download
• Ottinger B., Mathew A., König S., Albrecht J., Sprenger M., Müller L., Goth C., Franke J.:
  Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation
  In: Microelectronics Reliability (2023), Art.Nr.: 115097
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2023.115097
  BibTeX: Download
• Sprenger M., Kramer M., Tolyschew E., Steinau M., Renner D., Ottinger B., Franke J.:
  Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization
  24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, 16. April 2023 - 19. April 2023)
  In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
  DOI: 10.1109/EuroSimE56861.2023.10100795
  BibTeX: Download

2022

• Ottinger B., Murk S., König S., Zangarro A., Müllmaier M., Müller L., Franke J.:
  Location dependent down-rating of voids in high power solder connections for automotive power modules
  Conference of High Temperature Electronics Network (HITEN 2022) (St. Anne's College, Oxford, 18. Juli 2022 - 22. Juli 2022)
  BibTeX: Download
• Sprenger M., Forndran F., Ottinger B., Braun T., Franke J.:
  Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
  CIPS 2022 (Berlin, 15. März 2022 - 17. März 2022)
  In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
  BibTeX: Download
• Sprenger M., Forndran F., Ottinger B., Dammann T., Erben B., Sippel M., Franke J.:
  Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation
  23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (St Julian, 25. April 2022 - 27. April 2022)
  In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 2022
  DOI: 10.1109/EuroSimE54907.2022.9758880
  BibTeX: Download

2020

• Fedorova N., Ottinger B., Jovicic V., Zbogar-Rasic A., Delgado A., Virtanen S.:
  Static wettability of differently mechanically treated and amphiphobic-coated aluminium surfaces
  In: Materials 13 (2020), Art.Nr.: 2240
  ISSN: 1996-1944
  DOI: 10.3390/ma13102240
  BibTeX: Download