2024

• Ockel M., Gökçen A., Ottinger B., Petersen M., Voigt C., Franke J.:
  Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering
  International Thermal Spray Conference and Exposition (Mailand, 29. April 2024 - 1. Mai 2024)
  In: ITSC 2024 International Thermal Spray Conference and Exposition. Conference Proceedings and Poster Sessions, Düsseldorf: 2024
  BibTeX: Download
• Ottinger B., Holverscheid J., König S., Brunner A., Müller L., Goth C., Franke J.:
  Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules
  In: Advancing Microelectronics 51 (2024), S. 6-10
  ISSN: 2222-8748
  BibTeX: Download

2023

• Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
  Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
  In: Journal of Electronic Packaging 145 (2023)
  ISSN: 1043-7398
  DOI: 10.1115/1.4056992
  BibTeX: Download
• Ottinger B., Holverscheid J., König S., Brunner A., Müller L., Goth C., Franke J.:
  Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as die-attach method for automotive power modules
  International Conference and Exhibition on High Temperature Electronics (HITEC 2023) (Albuquerque, 18. April 2023 - 20. April 2023)
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• Ottinger B., Mathew A., König S., Albrecht J., Sprenger M., Müller L., Goth C., Franke J.:
  Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation
  In: Microelectronics Reliability (2023), Art.Nr.: 115097
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2023.115097
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• Sprenger M., Kramer M., Tolyschew E., Steinau M., Renner D., Ottinger B., Franke J.:
  Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization
  24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, 16. April 2023 - 19. April 2023)
  In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
  DOI: 10.1109/EuroSimE56861.2023.10100795
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2022

• Ottinger B., Holverscheid J., Konig S., Jerichow E., Lunz S., Sprenger M., Muller L., Goth C., Franke J.:
  Reliability of lead-free solders for die attach in automotive power modules
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013246
  BibTeX: Download
• Ottinger B., Murk S., König S., Zangarro A., Müllmaier M., Müller L., Franke J.:
  Location dependent down-rating of voids in high power solder connections for automotive power modules
  Conference of High Temperature Electronics Network (HITEN 2022) (St. Anne's College, Oxford, 18. Juli 2022 - 22. Juli 2022)
  BibTeX: Download
• Sprenger M., Forndran F., Ottinger B., Braun T., Franke J.:
  Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
  CIPS 2022 (Berlin, 15. März 2022 - 17. März 2022)
  In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
  BibTeX: Download
• Sprenger M., Forndran F., Ottinger B., Dammann T., Erben B., Sippel M., Franke J.:
  Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation
  23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (St Julian, 25. April 2022 - 27. April 2022)
  In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 2022
  DOI: 10.1109/EuroSimE54907.2022.9758880
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2020

• Fedorova N., Ottinger B., Jovicic V., Zbogar-Rasic A., Delgado A., Virtanen S.:
  Static wettability of differently mechanically treated and amphiphobic-coated aluminium surfaces
  In: Materials 13 (2020), Art.Nr.: 2240
  ISSN: 1996-1944
  DOI: 10.3390/ma13102240
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