Dipl. Wirtsch.-Ing. (FH) Thomas Stoll, M.Sc.
- Organisation: Department Maschinenbau (MB)
- Abteilung: Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
- Telefonnummer: +49 911 5302-99079
- Faxnummer: +49 911 5302-9070
- E-Mail: thomas.stoll@faps.fau.de
- Webseite: http://www.faps.uni-erlangen.de
- Adresse: Fürther Str. 246b
90429 NürnbergRaum 01.041-1
Aktuelle studentische Arbeiten
Passende News
2020
2018
- 01.12.2018: Neues Forschungsprojekt zur additiven Fertigung von Kühlkörpern für leistungselektronische Anwendungen genehmigt.
- 09.10.2018: Neues Forschungsprojekt zur additiven Fertigung leistungselektronischer Schaltungsträger genehmigt.
- 07.05.2018: Hochvakuum-Rohrofen wurde in Betrieb genommen.
2017
Presse Artikel
Publikationen
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Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF)
Laser 3D Manufacturing IX 2022 (Virtual, Online, 20. Januar 2022 - 24. Januar 2022)
In: Bo Gu, Hongqiang Chen, Henry Helvajian (Hrsg.): Proceedings of SPIE - The International Society for Optical Engineering 2022
DOI: 10.1117/12.2606382
BibTeX: Download - , , , , :
Process development for laser powder bed fusion of pure copper
In: Proceedings of SPIE Proceedings Volume 11271, Laser 3D Manufacturing VII; 112710I (2020) (2020)
DOI: 10.1117/12.2563870
BibTeX: Download - , , , , :
A new development of micro-copper sinter material for high power electronics application
11th International Conference on Integrated Power Electronics Systems, CIPS 2020 (Berlin, 24. März 2020 - 26. März 2020)
In: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems 2020
BibTeX: Download - , , , , , :
Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes
21st IEEE Electronics Packaging Technology Conference, EPTC 2019 (Singapore, SGP, 4. Dezember 2019 - 6. Dezember 2019)
In: 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019 2019
DOI: 10.1109/EPTC47984.2019.9026619
BibTeX: Download - , , :
A novel approach of copper-ceramic-joints manufactured by selective laser melting
In: Proceedings of SPIE Proceedings Volume 11101, Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems IV; 1110109 (2019) (2019)
ISSN: 0277-786X
DOI: 10.1117/12.2529422
BibTeX: Download - , :
Electrical and Mechanical Qualification of Selectively Dispensed Active Brazes
2018 13th International Congress Molded Interconnect Devices (MID) (Würzburg, 25. September 2018 - 26. September 2018)
DOI: 10.1109/ICMID.2018.8526981
BibTeX: Download - , , , , , , , , :
The future of short-range high-speed data transmission: printed polymer optical waveguides (POW) innovation, fabrication, and challenges
In: Proceedings of SPIE Proc. SPIE 10751, Optics and Photonics for Information Processing XII (2018), Art.Nr.: 1075109
ISSN: 0277-786X
DOI: 10.1117/12.2318752
BibTeX: Download - , , :
Additive Manufacturing of 3D-copper-metallizations on Alumina by means of Selective Laser Melting for Power Electronic Applications
In: Energietechnische Gesellschaft im VDE (ETG) (Hrsg.): CIPS 2018 10th International Conference on Integrated Power Electronic Systems, VDE Verlag, 2018, S. 337-342 (Proceedings March, 20 – 22, 2018, Stuttgart/Germany, Bd.156)
ISBN: 978-3-8007-4540-1
BibTeX: Download - , , :
Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes
In: Journal of Microelectronics and Electronic Packaging (2017), S. 761-767
ISSN: 1551-4897
DOI: 10.4071/isom-2017-THP51_10
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Investigations in Selective Laser Melting as Manufacturing Technology for the Production of High-temperature Mechatronic Integrated Devices
IMPACT 2016 (Taipei, Taiwan, 26. Oktober 2016 - 28. Oktober 2016)
In: 2016 IEEE and IMAPS IMPACT Conference 2016
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Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects
12th International Congress on Molded Interconnect Devices, MID 2016
DOI: 10.1109/ICMID.2016.7738929
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