2024

• Rachinger B., Seidel R., Meier S., Franke J.:
  Optimierung der Prozessparameter beim Selektivwellenlöten mit Hilfe von Offline Reinforcement Learning
  EBL Fellbach (Fellbach, 5. März 2024 - 6. März 2024)
  In: GMM-Fb. 107: EBL 2024 – Elektronische Baugruppen und Leiterplatten 2024
  URL: https://www.vde-verlag.de/buecher/456265/gmm-fb-107-ebl-2024-elektronische-baugruppen-und-leiterplatten.html
  BibTeX: Download
• Thielen N., Rachinger B., Schröder F., Preitschaft A., Meier S., Seidel R., Reinhardt A., Franke J.:
  Comparative Study on Different Methods to Generate Synthetic Data for the Classification of THT Solder Joints
  2024 1st International Conference on Production Technologies and Systems for E-Mobility (Bamberg, 5. Juni 2024 - 6. Juni 2024)
  In: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS), New York City: 2024
  DOI: 10.1109/EPTS61482.2024.10586740
  BibTeX: Download

2023

• Seidel R., Rachinger B., Thielen N., Schmidt K., Meier S., Franke J.:
  Development and validation of a digital twin framework for SMT manufacturing
  In: Computers in Industry 145 (2023)
  ISSN: 0166-3615
  DOI: 10.1016/j.compind.2022.103831
  BibTeX: Download

2022

• Seidel R., Ahrens T., Friedrich J., Reinhardt A., Franke J.:
  Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering
  In: Microelectronics Reliability 131 (2022), S. 114497
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2022.114497
  BibTeX: Download
• Seidel R., Ockel M., Franke J., Kästle C.:
  Impact of THT-hole dimensioning on manufacturability in selective wave soldering
  In: Microelectronics Reliability 137 (2022), S. 114773
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2022.114773
  BibTeX: Download
• Seidel R., Schmidt K., Thielen N., Franke J.:
  Trustworthiness of machine learning models in manufacturing applications using the example of electronics manufacturing processes
  55th CIRP Conference on Manufacturing Systems, CIRP CMS 2022 (Lugano, 29. Juni 2022 - 1. Juli 2022)
  In: Anna Valente, Emanuele Carpanzano, Claudio Boer (Hrsg.): Procedia CIRP 2022
  DOI: 10.1016/j.procir.2022.05.013
  BibTeX: Download
• Seidel R., Sippel M., Franke J.:
  2-D Fluid Simulation Approach for Miniwave Soldering
  DOI: 10.1109/ECTC51906.2022.00281
  BibTeX: Download
• Sippel M., Schmidt R., Rau F., Bretscher D., Seidel R., Franke J.:
  Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate
  12th International Conference on Integrated Power Electronics Systems (CIPS 2022) (Berlin, Germany, 15. März 2022 - 17. März 2022)
  In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
  BibTeX: Download

2021

• Seidel R., Sippel M., Franke J.:
  An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering
  IEEE 71st Electronic Components and Technology Conference (ECTC) (, ELECTR NETWORK)
  In: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), LOS ALAMITOS: 2021
  DOI: 10.1109/ECTC32696.2021.00228
  BibTeX: Download
• Thielen N., Jiang Z., Schmidt K., Seidel R., Voigt C., Reinhardt A., Franke J.:
  Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing
  IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Timisoara)
  In: 2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021), NEW YORK: 2021
  DOI: 10.1109/SIITME53254.2021.9663663
  BibTeX: Download

2020

• Schmidt K., Thielen N., Voigt C., Seidel R., Franke J., Milde Y., Bonig J., Beitinger G.:
  Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292292
  BibTeX: Download
• Seidel R., Hassan Amada M., Fuchs J., Thielen N., Schmidt K., Voigt C., Franke J.:
  Data Mining System Architecture for Industrial Internet of Things in Electronics Production
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292282
  BibTeX: Download
• Seidel R., Leibold F., Thielen N., Franke J.:
  Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression
  DOI: 10.1109/ISSE49702.2020.9121028
  URL: https://ieeexplore.ieee.org/document/9121028
  BibTeX: Download
• Seidel R., Thielen N., Schmidt K., Voigt C., Franke J.:
  Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292175
  BibTeX: Download
• Seidel R., Thielen N., Voigt C., Franke J.:
  Thermische Beurteilung von THT-Lötstellendesigns für die IPC-konforme Kontaktierung durch Selektivwellenlöten
  EBL 2020 (Fellbach, 18. Februar 2020 - 19. Februar 2020)
  BibTeX: Download
• Seidel R., Volland J., Thielen N., Voigt C., Franke J.:
  Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement
  ISSE 2020
  DOI: 10.1109/ISSE49702.2020.9120918
  BibTeX: Download
• Thielen N., Schmidt K., Seidel R., Franke J.:
  Maschinelles Lernen in der Elektronikproduktion: Herausforderungen und Anwendungsmöglichkeiten
  EBL 2020 – Elektronische Baugruppen und Leiterplatten - 10. DVS/GMM-Tagung (Fellbach, 18. Februar 2020 - 19. Februar 2020)
  In: VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM) (Hrsg.): GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten 2020
  BibTeX: Download
• Thielen N., Werner D., Schmidt K., Seidel R., Reinhardt A., Franke J.:
  A Machine Learning Based Approach to Detect False Calls in SMT Manufacturing
  43rd International Spring Seminar on Electronics Technology, ISSE 2020 (Demanovska Valley, 14. Mai 2020 - 15. Mai 2020)
  In: Proceedings of the International Spring Seminar on Electronics Technology 2020
  DOI: 10.1109/ISSE49702.2020.9121044
  BibTeX: Download

2019

• Mayr A., Kißkalt D., Meiners M., Lutz B., Schäfer F., Seidel R., Selmaier A., Fuchs J., Metzner M., Blank A., Franke J.:
  Machine Learning in Production – Potentials, Challenges and Exemplary Applications
  7th CIRP Global Web Conference – Towards shifted production value stream patterns through inference of data, models, and technology (CIRPe 2019) (Online, 16. Oktober 2019 - 18. Oktober 2019)
  In: Procedia CIRP 2019
  DOI: 10.1016/j.procir.2020.01.035
  URL: https://www.sciencedirect.com/science/article/pii/S2212827120300445?via=ihub
  BibTeX: Download
• Seidel R., Mayr A., Schäfer F., Kißkalt D., Franke J.:
  Towards a Smart Electronics Production Using Machine Learning Techniques
  42nd International Spring Seminar on Electronics Technology (ISSE) (Wroclaw, 15. September 2019 - 19. Mai 2019)
  In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE) 2019
  DOI: 10.1109/ISSE.2019.8810176
  URL: https://ieeexplore.ieee.org/document/8810176
  BibTeX: Download