2023

• Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
  Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
  International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
  In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
  DOI: 10.1109/ISSE57496.2023.10168387
  BibTeX: Download

2019

• Sippel M., Lomakin K., Ankenbrand M., Petersen M., Franke J., Helmreich K., Vossiek M., Gold G.:
  3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy
  28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019) (Montreal)
  DOI: 10.1109/EPEPS47316.2019.193232
  BibTeX: Download

2018

• Ankenbrand M., Scheetz M., Franke J., Lomakin K., Sippel M., Gold G., Helmreich K.:
  Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
  2018 13th International Congress Molded Interconnect Devices (MID)
  DOI: 10.1109/ICMID.2018.8527052
  BibTeX: Download
• Gräf D., Neermann S., Stuber L., Scheetz M., Franke J.:
  Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures
  In: 2018 13th International Congress Molded Interconnect Devices (MID) 2018
  DOI: 10.1109/ICMID.2018.8526995
  BibTeX: Download
• Hensel A., Schwarzer C., Scheetz M., Kaloudis M., Franke J.:
  Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations
  20th IEEE Electronics Packaging Technology Conference (EPTC) (Singapore, 4. Dezember 2018 - 7. Dezember 2018)
  In: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), NEW YORK: 2018
  DOI: 10.1109/eptc.2018.8654421
  BibTeX: Download
• Lomakin K., Pavlenko T., Ankenbrand M., Sippel M., Ringel J., Scheetz M., Klemm T., Gräf D., Helmreich K., Franke J., Gold G.:
  Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material
  In: IEEE Transactions on Components, Packaging and Manufacturing Technology (2018), S. 1-1
  ISSN: 2156-3950
  DOI: 10.1109/tcpmt.2018.2871931
  BibTeX: Download
• Neermann S., Scheetz M., Franke J., Roudenko J., Schirmer J., Reichenberger M.:
  Substrate pretreatments: an investigation of the effects on aerosol jet printed structures
  WGP-Jahreskongress
  DOI: 10.1007/978-3-030-03451-1_35
  BibTeX: Download