2024

• Sippel M., Tan YF., Schmidt R., Botazzoli P., Sprenger M., Franke J.:
  Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle
  In: Microelectronics Reliability 155 (2024), Art.Nr.: 115348
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2024.115348
  BibTeX: Download
• Utsch D., Sippel M., Voigt C., Häußler F., Franke J.:
  Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication
  In: Power Electronic Devices and Components 8 (2024), Art.Nr.: 100067
  ISSN: 2772-3704
  DOI: 10.1016/j.pedc.2024.100067
  BibTeX: Download

2023

• Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
  Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
  In: Journal of Electronic Packaging 145 (2023)
  ISSN: 1043-7398
  DOI: 10.1115/1.4056992
  BibTeX: Download
• Käsbauer M., Dreher P., Sippel M., Schmidt R.:
  Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography
  In: Microelectronics Reliability 150 (2023), Art.Nr.: 115064
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2023.115064
  BibTeX: Download
• Ockel M., Sippel M., Hecht C., Janisch L., Franke J.:
  A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing
  DOI: 10.1109/EPTC59621.2023.10457786
  BibTeX: Download
• Sippel M., Tan YF., Schmidt R., Botazzoli P., Sprenger M., Franke J.:
  Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds
  24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, AUT, 16. April 2023 - 19. April 2023)
  In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
  DOI: 10.1109/EuroSimE56861.2023.10100802
  BibTeX: Download
• Utsch D., Häußler F., Voigt C., Sippel M., Franke J.:
  Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
  46th International Spring Seminar on Electronics Technology (Timisoara, 10. Mai 2023 - 14. Mai 2023)
  DOI: 10.1109/ISSE57496.2023.10168526
  BibTeX: Download

2022

• Hecht C., Slama JN., Sprenger M., Haubler F., Sippel M., Franke J.:
  Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
  28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
  In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
  DOI: 10.1109/SIITME56728.2022.9987997
  BibTeX: Download
• Häußler F., Sippel M., Sprenger M., Liu L., Muckelbauer M., Franke J.:
  High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
  2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
  DOI: 10.1109/ESTC55720.2022.9939424
  BibTeX: Download
• Schmidt R., Kaesbauer M., Endres M., Sippel M., Botazzoli P.:
  Power Cycling Lifetime of Shunt Resistors in IGBT Modules
  12th International Conference on Integrated Power Electronics Systems (CIPS 2022) (Berlin, Germany, 15. März 2022 - 17. März 2022)
  In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
  BibTeX: Download
• Seidel R., Sippel M., Franke J.:
  2-D Fluid Simulation Approach for Miniwave Soldering
  DOI: 10.1109/ECTC51906.2022.00281
  BibTeX: Download
• Sippel M., Hassel S., Schmidt R., Sprenger M., Hecht C., Franke J.:
  Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
  9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 (Sibiu, 13. September 2022 - 16. September 2022)
  In: 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings 2022
  DOI: 10.1109/ESTC55720.2022.9939542
  BibTeX: Download
• Sippel M., Schmidt R., Kaesbauer M., Sprenger M., Hensel A., Franke J.:
  Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test
  2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
  In: IEEE (Hrsg.): Electronics Packaging Technology Conference (EPTC) 2022
  DOI: 10.1109/EPTC56328.2022.10013275
  BibTeX: Download
• Sippel M., Schmidt R., Rau F., Bretscher D., Seidel R., Franke J.:
  Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate
  12th International Conference on Integrated Power Electronics Systems (CIPS 2022) (Berlin, Germany, 15. März 2022 - 17. März 2022)
  In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
  BibTeX: Download
• Sprenger M., Forndran F., Ottinger B., Dammann T., Erben B., Sippel M., Franke J.:
  Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation
  23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (St Julian, 25. April 2022 - 27. April 2022)
  In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 2022
  DOI: 10.1109/EuroSimE54907.2022.9758880
  BibTeX: Download

2021

• Seidel R., Sippel M., Franke J.:
  An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering
  IEEE 71st Electronic Components and Technology Conference (ECTC) (, ELECTR NETWORK)
  In: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), LOS ALAMITOS: 2021
  DOI: 10.1109/ECTC32696.2021.00228
  BibTeX: Download

2020

• Schmidt R., Kaesbauer M., Sippel M., Dreher P.:
  Power Cycle Testing at Low Temperature Swings – Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers
  11th International Conference on Integrated Power Electronics Systems (CIPS 2020)
  In: Proceedings of the 11th International Conference on Integrated Power Electronics Systems (CIPS 2020), Berlin and Offenbach: 2020
  BibTeX: Download