Gerald Gion, Dipl.-Ing.
Passende News
2022
2016
Publikationen
2014
Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID
In: Franke J, Kuhn T, Birkicht A, Pojtinger A (Hrsg.): 11th International Congress Molded Interconnect Devices, Pfaffikon: 2014
DOI: 10.4028/www.scientific.net/AMR.1038.115
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