2014

• Goth C., Kuhn T., Gion G., Franke J.:
  Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID
  In: Franke J, Kuhn T, Birkicht A, Pojtinger A (Hrsg.): 11th International Congress Molded Interconnect Devices, Pfaffikon: 2014
  DOI: 10.4028/www.scientific.net/AMR.1038.115
  BibTeX: Download